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  • OPC-370 CONDICLEAN MA-S

    • Alkaline conditioner with cleaning power
      Show high catalyst adsorption performance to glass cloth
      Not containing PFAS
    • Conditioner
    • Printed Wiring Board
  • OPC STARCLEAN A-S

    • Can use for the substrates that are weak to allkali
      Easily remove foams after cleaning
      Can use at a lower temperature to save energy cost
      Not containing PFAS, endocrine disrupting chemicals
    • Conditioner
    • Printed Wiring Board
  • OPC-390 CONDICLEAN MA-S

    • Alkaline conditioner with cleaning power
      Suitable for FPC boards
      Not containing PFAS, endocrine disrupting chemicals
    • Conditioner
    • Printed Wiring Board
  • OPC-350 CONDITIONER A-S

    • Weakly acidic conditioner liquid that improves catalyst adsorption
      Not containing PFAS, endocrine disrupting chemicals
    • Conditioner
    • Printed Wiring Board
  • OPC FLET-S PROCESS

    • The OPC FLET-S process is an electroless copper plating process suitable for the subtractive method, MSAP. Excellent for uniform deposition on the material surface, via holes, and through holes, reducing circuit width narrowing during flash etching, and suppressing precipitation on copper, resulting in continuous crystal formation between inner layer copper and upper layer plating copper This is the optimum process for improving reliability by realizing reliability.
    • Process Chemicals for Subtractive Process/MSAP
    • Printed Wiring Board
  • OPC-1400 NEUTRALIZER VCC

    • Cleaning and conditioning epoxy surface after micro-etching
      Strong permeability into micro-holes and small areas
      Low-foaming, can use de-smear equipment by conveyance system
    • De-smear Process

      Neutralizer
    • Printed Wiring Board
  • OPC-1300 NEUTRALIZER(EDCM)

    • Use after OPC-1200 EPOETCH step
      Strongly clean etched surface of epoxy resin
      Excellent in permeability to small holes and areas
      Not containing PFOS, PFOA, endocrine disrupting chemicals
    • De-smear Process

      Neutralizer
    • Printed Wiring Board
  • OPC CONDICLEAN SCD

    • Promote catalyst adsorption evenly
      High deposition performance to substrates that can't be plated easily
      Weak alkaline based, can use for substrates that can't be treated by alkali
      Excellent permeability into small-diameter blind via holes
      High cleaning performance to copper foils
    • Conditioner
    • Printed Wiring Board
  • BUILD COPPER

    • Electroless copper plating solution, EDTA-based
      High bath stability, great deposition performance
    • Electroless Copper Plating Solution
    • Printed Wiring Board
  • OPC COPPER T

    • Electroless copper plating solution for ceramic substrates
      For high-speed, thick plating
      EDTA-based product
    • Electroless Copper Plating Solution
    • Printed Wiring Board
  • OPC COPPER AF

    • Electroless copper plating solution
      Weak alkaline product, EDTA- and formaldehyde-free product
      High bath stability, very low inner stress
    • Electroless Copper Plating Solution
    • Printed Wiring Board
  • OPC-750 ELECTROLESS COPPER M

    • Electroless copper plating solution, EDTA-based
      High bath stability
      Can use for a long time
    • Electroless Copper Plating Solution
    • Printed Wiring Board
  • OPC-700 ELECTROLESS COPPER M-K

    • Electroless copper plating solution, rochelle salt based
      Excellent color tones after plating
    • Electroless Copper Plating Solution
    • Printed Wiring Board
  • ATS ADDCOPPER VR

    • Electroless copper plating solution, rochelle salt based
      Can obtain smooth and bright appearances
      Suitable for rolled copper foils to prevent nodules after acid copper plating
    • Electroless Copper Plating Solution
    • Printed Wiring Board
  • OPC-80 CATALYST ML

    • Use as acidic catalyst containing palladium-tin colloids
      High bath stability
      Long bath life
    • Catalyzing Agent
    • Printed Wiring Board
  • OPC-80 CATALYST

    • Use as acidic catalyst containing palladium-tin colloids
      Great catalyst adsorbing power
      Suitable for substrates that can't be treated easily
    • Catalyzing Agent
    • Printed Wiring Board
  • OPC-555 ACCELERATOR M

    • Very tolerant to tin
      Have long bath life
      Fluoride-based product
    • Accelerator
    • Printed Wiring Board
  • OPC-505 ACCELERATOR

    • Strongly activate palladium catalysts
      Strong tolerance to tin
      Sulfuric-acid based product
    • Accelerator
    • Printed Wiring Board
  • OPC-500 ACCELERATOR MX

    • Activate palladium catalysts to improve deposition-, adhesion-performance
      Sulfuric-based product
    • Accelerator
    • Printed Wiring Board
  • OPC-PREDIP AD

    • Use for pre-dipping to increase catalyst bath stability
    • Pre-dipping Agent
    • Printed Wiring Board
  • OPC-SAL

    • Use for pre-dipping with OPC-PREDIP AD
      Increase acidic-type catatyst bath stability
    • Pre-dipping Agent
    • Printed Wiring Board
  • OPC-SAL M

    • Use for pre-dipping
      Can increase catalyst bath stability
    • Pre-dipping Agent
    • Printed Wiring Board
  • OPC-1540MN

    • Use with OPC-1200 EPOETCH, sodium permanganate based solution
      Can use for de-smear to clean inner copper foils
      Make concave and convex surfaces finely on epoxy resin
    • De-smear Process

      Etchant
    • Printed Wiring Board
  • OPC-1400 NEUTRALIZER

    • Can reduce foaming
      Suitable for horizontal system of de-smear step
    • De-smear Process

      Neutralizer
    • Printed Wiring Board
  • OPC-1200 EPOETCH

    • Can use for de-smear to clean inner copper foils
      Make concave and convex surfaces finely on epoxy resin
    • De-smear Process

      Etchant
    • Printed Wiring Board
  • OPC-1080 CONDITIONER

    • Use as swelling agent, can control natural consumption
      Can clean hole inside
      Can use for de-smear strongly
    • De-smear Process

      Swelling agent
    • Printed Wiring Board
  • OPC-1050 CONDITIONER

    • Swelling agent to clean hole inside and work as de-smear
      Work for conditioning on resin surface
    • De-smear Process

      Swelling agent
    • Printed Wiring Board
  • OPC-480 SOFT ETCH

    • Acidic powder type, soft etching agent
      Can make concave and convex surfaces finely
      Improve adhesion performance of surfaces
    • Soft Etching Agent
    • Printed Wiring Board
  • OPC-465 SOFT ETCH

    • Hydrogen-peroxide and sulfuric acid based
      Can replenish sulfuric acid, economical product
      Maintain etching performance from initial make-up to renewal time
    • Soft Etching Agent
    • Printed Wiring Board
  • ATS PRECONDITION PIW-1

    • Use as conditioner for flex-rigid PWBs that has exposed polyimide films
      Prevent blisters
    • Surface Conditioner
    • Printed Wiring Board
  • OPC CONDICLEAN FCR

    • Designed as alkaline conditioner with cleaning power
      Improve palladium adsorption
      Prevent bad damage to adhesion with copper
    • Conditioner
    • Printed Wiring Board
  • OPC-380 CONDICLEAN MA

    • Alkaline conditioner with cleaning power
      Show high catalyst adsorption performance
    • Conditioner
    • Printed Wiring Board